Wetting and interface phenomena in the molten Sn/CuFeNiCoCr high-entropy alloy system

- Interactions occurred between molten Sn and CuFeNiCoCr HEA substrate.
- The wetting angle varied with the wetting temperature.
- An intermetallic compound existed at the interface.
- Three stages were identified in the wetting process.
- Cu-rich FCC solid-solution phases provides a “wetting channel”.