Material removal mechanism during porous silica cluster impact on crystal silicon substrate studied by molecular dynamics simulation

► The impact of the porous silica clusters on a silicon substrate was studied by MD. ► The porous cluster shows high MRR and low surface damage at an optimal pore size. ► The high MRR is due to the combined effects of plough, adhesion and permeation. ► The low surface damage is due to the decreasing of the penetration depth. ► Enlarged contact area is more effective than increased penetration to enhance MRR.