کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5357972 | 1503613 | 2015 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Surface characteristics of ruthenium in periodate-based slurry during chemical mechanical polishing
ترجمه فارسی عنوان
خصوصیات سطحی روتونیوم در دوغاب بر پایه دوره ای در طی پرداخت های مکانیکی شیمیایی
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
چکیده انگلیسی
When the feature size of integrated circuit continues to shrink below 14 nm, ruthenium (Ru) has become one of the most promising candidates for the application of novel barrier layer. To reveal the material removal mechanism of Ru during chemical mechanical polishing (CMP), surface characteristics of Ru in KIO4-based slurry were investigated. The corrosion behavior of ruthenium was measured by the surface chemistry and morphology analysis. Then the mechanical properties of the passivated/corroded surface were evaluated by AES and tribocorrosion experiments. CMP experiments were carried out to make clear the effects of surface property during polishing. It was found that the Ru surface chemistry and mechanical properties vary obviously as a function of slurry pH. In neutral slurries, the Ru surface is covered with RuO2·2H2O/RuO3 inhomogeneous passivation films, with the highest material removal rate obtained during the CMP process. It could be concluded that the material removal mechanism largely depends on the slurry pH values. In near neutral slurries, Ru is passivated with thick and heterogeneous oxides film, which proves the easiest to be mechanically removed during polishing. The weak alkaline slurry is preferred in order to achieve desirable polishing rate as well as avoid the formation of toxic RuO4.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 351, 1 October 2015, Pages 401-409
Journal: Applied Surface Science - Volume 351, 1 October 2015, Pages 401-409
نویسندگان
Jie Cheng, Tongqing Wang, Liang Jiang, Xinchun Lu,