کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5370192 | 1388475 | 2006 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Laser-induced site-selective silver seeding on polyimide for electroless copper plating
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
شیمی
شیمی تئوریک و عملی
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Laser-induced site-selective silver seeding on polyimide for electroless copper plating Laser-induced site-selective silver seeding on polyimide for electroless copper plating](/preview/png/5370192.png)
چکیده انگلیسی
Ag particles were generated on Ag+-doped polyimide film by laser direct writing, followed by selective copper deposition using the metallic silver particles as seeds. Laser irradiation caused in situ reduction and agglomeration of silver on the polyimide film. The copper lines were less uniform and compact with higher scanning velocity and the width of the deposited copper line could reach 25 μm. Equations of the relationship between scanning velocity and connectivity of the deposited copper patterns have been derived. The process was characterised by AFM, XPS, SEM, and semiconductor characterisation system.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Surface Science - Volume 253, Issue 3, 30 November 2006, Pages 1573-1580
Journal: Applied Surface Science - Volume 253, Issue 3, 30 November 2006, Pages 1573-1580
نویسندگان
Dongsheng Chen, Qinghua Lu, Yan Zhao,