کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
538409 | 871089 | 2014 | 9 صفحه PDF | دانلود رایگان |
![عکس صفحه اول مقاله: Nano-CMOS thermal sensor design optimization for efficient temperature measurement Nano-CMOS thermal sensor design optimization for efficient temperature measurement](/preview/png/538409.png)
• A robust design flow is proposed to design and characterize nano-CMOS based thermal sensors.
• An optimization methodology is presented for fast design space exploration of thermal sensors.
• A modified Stochastic Gradient Descent (SGD) algorithm is presented for thermal sensor optimization.
• A 45 nm RO based thermal based sensor is designed at the layout level and optimized.
• A statistical analysis on the impact of process variation on the performance of the thermal sensor is presented.
• A perspective comparison of similar designs is also presented.
We present a novel and efficient thermal sensor design methodology. The growing demand for power management on VLSI systems drives the need for accurate thermal sensors. Conventional design techniques for on-chip thermal sensors in nanometer technologies consume expensive design iterations and result in increased power consumption and area overhead. Power-efficient, high-sensitivity thermal sensors are important for reducing the thermal stress on the systems or circuits which are being monitored. The proposed design flow methodology, which incorporates a stochastic gradient descent (SGD) algorithm, optimizes the power consumption (including leakage) of IC subsystems. An illustration of the proposed design methodology is presented using a ring oscillator (RO) based on-chip thermal sensor which was designed using 45 nm CMOS technology. The RO based thermal sensor has a resolution of 0.097 °C/bit. Experimental tests and analysis of the design methodology on a full layout-accurate parasitic netlist of the RO demonstrate the applicability of our methodology towards optimization of the power consumption with temperature resolution as a design constraint. A reduction of power consumption by 52% with a final area of 1389.1μm2 is obtained.
Journal: Integration, the VLSI Journal - Volume 47, Issue 2, March 2014, Pages 195–203