کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
538409 871089 2014 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Nano-CMOS thermal sensor design optimization for efficient temperature measurement
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
Nano-CMOS thermal sensor design optimization for efficient temperature measurement
چکیده انگلیسی


• A robust design flow is proposed to design and characterize nano-CMOS based thermal sensors.
• An optimization methodology is presented for fast design space exploration of thermal sensors.
• A modified Stochastic Gradient Descent (SGD) algorithm is presented for thermal sensor optimization.
• A 45 nm RO based thermal based sensor is designed at the layout level and optimized.
• A statistical analysis on the impact of process variation on the performance of the thermal sensor is presented.
• A perspective comparison of similar designs is also presented.

We present a novel and efficient thermal sensor design methodology. The growing demand for power management on VLSI systems drives the need for accurate thermal sensors. Conventional design techniques for on-chip thermal sensors in nanometer technologies consume expensive design iterations and result in increased power consumption and area overhead. Power-efficient, high-sensitivity thermal sensors are important for reducing the thermal stress on the systems or circuits which are being monitored. The proposed design flow methodology, which incorporates a stochastic gradient descent (SGD) algorithm, optimizes the power consumption (including leakage) of IC subsystems. An illustration of the proposed design methodology is presented using a ring oscillator (RO) based on-chip thermal sensor which was designed using 45 nm CMOS technology. The RO based thermal sensor has a resolution of 0.097 °C/bit. Experimental tests and analysis of the design methodology on a full layout-accurate parasitic netlist of the RO demonstrate the applicability of our methodology towards optimization of the power consumption with temperature resolution as a design constraint. A reduction of power consumption by 52% with a final area of 1389.1μm2 is obtained.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Integration, the VLSI Journal - Volume 47, Issue 2, March 2014, Pages 195–203
نویسندگان
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