Modeling of power devices with drift region integrated microchannel cooler

This paper introduces the DRIMCooler—an innovative concept allowing to integrate the heat exchanger directly into the active region of a vertical power device. Based on the realization of vertical edge terminations and the use of dielectric coolant fluid circulation, arrays of through wafer channels are etched in the silicon substrate offering a large heat exchange coefficient while minimizing the pressure drops. The concept is introduced and discussed with respect to the technological and the electrical issues. The thermal analysis is based on numerical models and simulations. The obtained results show excellent thermal and hydraulic performances of the DRIMCooler concept.