High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy

High-strength and thermal stable Cu-to-Cu joint fabricated with transient molten Ga and Ni under-bump-metallurgy

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 702, 25 April 2017, Pages 561-567

Shih-kang Lin, Mei-jun Wang, Che-yu Yeh, Hao-miao Chang, Yu-chen Liu,