Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Demonstration of sub 150 °C Cu-Cu thermocompression bonding for 3D IC applications, utilizing an ultra-thin layer of Manganin alloy as an effective surface passivation layer

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 194, 1 May 2017, Pages 86-89

Asisa Kumar Panigrahi, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh,