کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5464095 | 1517195 | 2017 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Plastic deformation of Cu single crystals containing an elliptic cylindrical void
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
Molecular dynamics simulations are performed to study the plastic deformation of Cu single crystals containing an elliptic cylindrical void. The effects of initial void geometry including void ellipticity and void orientation angle on plastic deformation are examined by considering the stress-strain response, dislocation nucleation from the void surface, and porosity/void cross-sectional shape evolution. It is found that (i) the initial void geometry plays an important role and (ii) the growth of voids with an increasing initial ellipticity converges to that of a crack. Our results reveal the underlying mechanisms of initial void ellipticity- and orientation angle-dependent plastic deformation of metallic solids, and provide direct evidence that there is no dividing line between a void and a crack in terms of the mechanical responses of these solids.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 193, 15 April 2017, Pages 283-287
Journal: Materials Letters - Volume 193, 15 April 2017, Pages 283-287
نویسندگان
Shuozhi Xu, Yanqing Su, Dengke Chen, Longlei Li,