کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
5465007 | 1517562 | 2017 | 5 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Inducing stable interfacial delamination in a multilayer system by four-point bending of microbridges
ترجمه فارسی عنوان
ایجاد خلوص پایدار بین فاز در یک سیستم چند لایه با خم شدن چهار نقطه از میکرو باند
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فناوری نانو (نانو تکنولوژی)
چکیده انگلیسی
The ability to produce stable delamination of thin film multilayer interfaces is a powerful tool for studying the interfacial adhesion within microsystems. In this study, a technique involving the four-point bending of microbridges was applied to initiate stable interfacial delamination within a multilayer system. Microscale pre-notched bridges with clamped-ends were machined into an Al/SiN/GaAs multilayer using focus ion beam milling. A square flat-end indenter was used to induce bending of the bridge by two contact locations. Bridge failure occurred via substrate fracture at the pre-notch, followed by crack deflection, and stable interfacial delamination of the SiN/GaAs interface. Substrate fracture and delamination were identified within the obtained load-displacement curves as a pop-in and region of linear load reduction respectively.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 320, 25 June 2017, Pages 478-482
Journal: Surface and Coatings Technology - Volume 320, 25 June 2017, Pages 478-482
نویسندگان
James L. Mead, Mingyuan Lu, Han Huang,