کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
579977 1453147 2010 6 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Formation of copper aluminate spinel and cuprous aluminate delafossite to thermally stabilize simulated copper-laden sludge
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی بهداشت و امنیت شیمی
پیش نمایش صفحه اول مقاله
Formation of copper aluminate spinel and cuprous aluminate delafossite to thermally stabilize simulated copper-laden sludge
چکیده انگلیسی
The study reported herein indicated the stabilization mechanisms at work when copper-laden sludge is thermally treated with γ-alumina and kaolinite precursors, and evaluated the prolonged leachability of their product phases. Four copper-containing phases - copper oxide (CuO), cuprous oxide (Cu2O), copper aluminate spinel (CuAl2O4), and cuprous aluminate delafossite (CuAlO2) - were found in the thermal reactions of the investigated systems. These phases were independently synthesized for leaching by 0.1 M HCl aqueous solution, and the relative leachabilities were found to be CuAl2O4 < CuAlO2 ≪ Cu2O < CuO. The sintering condition and formation mechanism employed to stabilize copper into CuAl2O4 and CuAlO2 are extensively discussed here. With a 3 h of short sintering, it was found that CuAl2O4 could be effectively formed between 850 and 950 °C by the γ-alumina precursor. Although kaolinite had a lower incorporation capability than γ-alumina, it was found to transform a considerable amount of copper into CuAl2O4 between 950 and 1000 °C. At higher temperatures, CuAlO2 was produced only in the γ-alumina system as the occurrence of Cu2O-cristobalite solution in the kaolinite system precluded the production of CuAlO2. The hypothesis that the spinel formation mechanism has two stages was supported by the results of the changing Cu/Al mole ratio in the system, and the rate-limiting step was identified as the diffusion process in the second stage.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Hazardous Materials - Volume 181, Issues 1–3, 15 September 2010, Pages 399-404
نویسندگان
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