Fabrication and performance evaluation of flexible heat pipes for potential thermal control of foldable electronics

• A flexible and high-performance heat pipe is fabricated.
• Bending effect on thermal performance of flexible heat pipes is evaluated.
• Theoretical analysis is carried out to reveal the change of thermal resistance with bending.
• Thermal control of foldable electronics with flexible heat pipes is demonstrated.

In this work, we report the fabrication and thermal performance evaluation of flexible heat pipes prepared by using a fluororubber tube as the connector in the adiabatic section and using strong base treated hydrophilic copper meshes as the wick structure. Deionized water was chosen as working fluid and three different filling ratios (10%, 20%, and 30%) of working fluid were loaded into the heat pipe to investigate its impact on thermal performance. The fabricated heat pipes can be easily bended from 0o to 180o in the horizontal operation mode and demonstrated consistently low thermal resistances after repeated bending. It was found that with optimized amount of working fluid, the thermal resistance of flexible heat pipes increased with larger bending angles. Theoretical analysis reveals that bending disturbs the normal vapor flow from evaporator to condenser in the heat pipe, thus leads to increased liquid–vapor interfacial thermal resistance in the evaporator section. The flexible heat pipes have been successfully applied for thermal control of foldable electronic devices showing superior uniform heat-transfer performance.