کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
645469 | 1457142 | 2015 | 8 صفحه PDF | دانلود رایگان |
• Change the distribution of copper wire can improve the isothermal performance.
• The copper wire in the isothermal chamber was layered filling.
• The porosity must decrease gradually from the center to the container wall.
In order to improve the isothermal performance of isothermal chamber, how the distribution of thin copper wire on chamber cross-section enhances the heat transfer from wall to center was studied in this paper. Firstly, the heat conduction model was established and the temperature fields and the center temperature were calculated under the condition of the copper wire was stuffed uniformly. Secondly, under the circumstance that the temperature of chamber wall, the average stuffed density of copper wire and initial temperature in the center were certain, taking the maximum of center temperature as the optimization objective after heat conduction lasting 15 s, the variable density method and the adaptive growth method were used respectively to optimize the distribution of copper wire in order to enhance the heat conduction from the chamber wall to the center. Compared with the uniformly filling, the results of the center temperature were increased 4.94% and 16.50% respectively. Moreover the corresponding copper wire porosity distribution curves were obtained. Finally, the copper wire in the isothermal chamber was layered filled based on the optimized results. Then the verification experiments and verification simulation were carried out to verify that change the distribution of copper wire could enhance the heat conduction from the wall to center. Moreover, according to the results of discharging experiments for isothermal chamber, it was verified that the filling scheme could improve the isothermal performance of isothermal chamber.
Journal: Applied Thermal Engineering - Volume 86, 5 July 2015, Pages 301–308