کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
646716 | 1457159 | 2014 | 8 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A high power LED device with chips directly mounted on heat pipes
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موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
A novel columnar heat pipe (CHP) leadframe for high power LED device was developed. 42 high power LED chips were mounted on its surface directly. The thermal performance, luminous and chromaticity of the CHP leadframe base LED device are tested and discussed experimentally. The obtained results show that the thermal resistances Rl-s (from the leadframe to the heat sink) and Rj-a (from the LED chip to the ambient) of the CHP leadframe are 0.23 °C/W and 1.65 °C/W at 2800 mA, respectively. The luminous efficacy of the CHP leadframe LED device is 66.23 lm/W at 2800 mA. It is 19.2% higher than the conventional copper leadframe LED device. The correlated color temperature (CCT) shift value of the CHP leadframe is 381 K and it is lower than that of the copper leadframe by 23.5%. The discussed results show that the CHP leadframe has an outstanding performance for high power LED lighting.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Applied Thermal Engineering - Volume 66, Issues 1â2, May 2014, Pages 632-639
Journal: Applied Thermal Engineering - Volume 66, Issues 1â2, May 2014, Pages 632-639
نویسندگان
Yong Tang, Xinrui Ding, Binhai Yu, Zongtao Li, Bin Liu,