Transient cooling of electronic components by flat heat pipes

► In this study we model a Flat Heat Pipe (FHP) designed for the cooling of electronic components. ► This model is a transient model, coupling 3D thermal and hydrodynamic models. ► The model makes it possible to obtain the FHP wall transient temperatures. ► Transient pressures, velocities and temperatures in liquid and vapor phases are also obtained. ► We conclude that FHP is more efficient for long than very short thermal cycles.