Surface modification effects of SiC tile on the wettability and interfacial bond strength of SiC tile/Al7075-SiCp hybrid composites

- The surface of SiC tile (SiCt) was modified by oxidation, Ni plating, and Si coating.
- The tendency to attain wetting between the modified SiCt and Al7075 was improved.
- The interfacial bond strength between the modified SiCt and Al7075 increased.
- The surface modification suppressed the formation of Al4C3 at the interface.

This study investigates the effects of a surface modification of a SiC tile on the wetting behavior and interfacial bond strength of SiC tile/Al7075-SiCp hybrid composites fabricated by a liquid-press process. SiO2, Ni, and Si layers were fabricated on each SiC tile, and the microstructures at the interface between the surface-modified SiC tile and the Al7075 were analyzed. In addition, the interfacial bond strength and wettability between the SiC tile and Al7075 were measured by the push-out method and the sessile drop method, respectively. The interfacial bond strength and wettability tests demonstrate that the surface modification of a SiC tile with Al7075 can effectively improve the tendency to attain wetting between the SiC tile and Al7075, due to the suppression of the formation of brittle Al4C3 at the interface between the SiC tile and Al7075.