An experimental investigation on a novel high-performance integrated heat pipe–heat sink for high-flux chip cooling

The investigation of high-performance cooling device is highly desired. Heat pipe is a promising candidate to meet the thermal management challenges in the future. In the current investigation, a novel integrated heat pipe–heat sink is presented with a new design of condenser and wick structure. Experimental investigation on its thermal performance and pressure drop is conducted. For a total power of 420 W, the thermal resistance is 0.118 K/W and the maximum temperature difference reaches 50 K when the air flow rate is 71 m3/h (about 2.9 m/s frontal velocity) with pressure drop of 30 Pa.