کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
658202 1458080 2013 11 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
On microchannel shapes in liquid-cooled electronics applications
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
On microchannel shapes in liquid-cooled electronics applications
چکیده انگلیسی
We consider the effect of modulating the microchannel shapes within a liquid-cooled device to determine how geometry affects heat transfer effects. By using the asymptotic approach of homogenization, we find a single advection-diffusion equation, which has an anisotropic thermal conductivity tensor that depends on the local channel width and laminate thickness. A novel modification of the homogenization approach is used to allow the spacing of the microchannels and laminates to vary over the macroscale, relaxing the spatial periodicity requirement of the technique. We find that the anisotropic thermal conductivity corresponds to two different classes of steady thermal solutions: a hot spot symmetric along the centerline, or two maxima which are symmetric about the centerline. The location of the hot spot depends on the energy balance between convective transport in the streamwise direction and effective conduction in the spanwise direction. Optimiziation formulations for families of channel/laminate geometries are performed to find minimum average temperatures within each of these families.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 62, July 2013, Pages 163-173
نویسندگان
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