کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
660041 | 1458140 | 2008 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The transient performance of a flat heat pipe (FHP) used to cool multiple electronics components, is presented in this paper. The fluid flows in both wick and vapor core were computed using a transient 2D hydrodynamic model (T2DHM). This model was coupled with a transient 3D thermal model (T3DTM) of the FHP wall, designed to calculate the heat transfer through the wall. An interesting procedure for solving the governing equations for the heat and mass transfers inside the FHP is proposed. The phase change mechanisms at the liquid-vapor interface are included in this procedure through the Clausius-Clapeyron law. During a start-up, the T2DHM is able to predict the velocity and pressure distribution of the liquid and the vapor, and thus the transient response of the FHP.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 51, Issues 25â26, December 2008, Pages 6006-6017
Journal: International Journal of Heat and Mass Transfer - Volume 51, Issues 25â26, December 2008, Pages 6006-6017
نویسندگان
R. Sonan, S. Harmand, J. Pellé, D. Leger, M. Fakès,