A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier

A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier

Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Electrochemistry Communications - Volume 87, February 2018, Pages 9-12

Giin-Shan Chen, Tzu-Ming Yang, Sung-Te Chen, Yi-Lung Cheng, Jau-Shiung Fang,