Keywords: کم دی الکتریک K; Low-k dielectric; Ellipso-porosimetry; NMR; ToF-SIMS; Plasma; Porous organosilicate;
مقالات ISI کم دی الکتریک K (ترجمه نشده)
مقالات زیر هنوز به فارسی ترجمه نشده اند.
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در صورتی که به ترجمه آماده هر یک از مقالات زیر نیاز داشته باشید، می توانید سفارش دهید تا مترجمان با تجربه این مجموعه در اسرع وقت آن را برای شما ترجمه نمایند.
Keywords: کم دی الکتریک K; Low-k dielectric; Porogen; Moisture; Reliability; Breakdown; TDDB; Electromigration
A new alternative self-assembled-monolayer activation process for electroless deposition of copper interconnects without a conventional barrier
Keywords: کم دی الکتریک K; Electroless deposition; Self-assembled monolayer; Seeding; Cu interconnect; Low-k dielectric;
On the use of (3-trimethoxysilylpropyl)diethylenetriamine self-assembled monolayers as seed layers for the growth of Mn based copper diffusion barrier layers
Keywords: کم دی الکتریک K; Self-assembled monolayers; Manganese silicate; XPS; Low-k dielectric; Interconnects;
Investigation of the barrier properties of copper-vanadium alloys with a sub-tantalum layer on low-k dielectrics
Keywords: کم دی الکتریک K; Cu interconnect; Diffusion barrier; Cu-V alloy; Ta; Low-k dielectric;
Improvement of cohesion strength in ULK OSG materials by pore structure adjustment
Keywords: کم دی الکتریک K; Low-k dielectric; Spin-on; Cohesion; 4-Point bending test;
Atomic layer deposition HfO2 capping layer effect on porous low dielectric constant materials
Keywords: کم دی الکتریک K; Low-k dielectric; Porogen; HfO2; Reliability; Breakdown; TDDB;
Effect of thermal treatment on physical, electrical properties and reliability of porogen-containing and porogen-free ultralow-k dielectrics
Keywords: کم دی الکتریک K; Low-k dielectric; Porogen; UV curing; Reliability; Breakdown; TDDB
Permittivity of modified polyimide layers on LTCC
Keywords: کم دی الکتریک K; Low-k dielectric; Porosity; LTCC; Polyimide; Compound material; High frequency; Patch antenna
Pore sealing of mesoporous silica low-k dielectrics by oxygen and argon plasma treatments
Keywords: کم دی الکتریک K; Plasma treatment; Pore sealing; Low-k dielectric
Investigation of reduction in etch rate of isolated holes in SiOCH
Keywords: کم دی الکتریک K; Reactive ion etching; Low-k dielectric; BEOL process integration; Thermal-desorption spectroscopy (TDS)
Diffusion of solvents in thin porous films
Keywords: کم دی الکتریک K; Low-k dielectric; Porosity; Diffusion; Pore interconnectivity
A new structure and its analytical model for the electric field and breakdown voltage of SOI high voltage device with variable-k dielectric buried layer
Keywords: کم دی الکتریک K; Low-k dielectric; Electric field; Modulation; Breakdown voltage; RESURF
Characterization of spin-on-glass very-low-k polymethylsiloxane with copper metallization
Keywords: کم دی الکتریک K; Low-k dielectric; Surface modification; Plasma treatment;
Analysis of HSG-7000 silsesquioxane-based low-k dielectric hot plate curing using Raman spectroscopy
Keywords: کم دی الکتریک K; HSG 7000; Low-k dielectric; Raman spectroscopy; Hot plate curing
Crack initiation in Cu-interconnect structures
Keywords: کم دی الکتریک K; Crack initiation; Fracture criterion; Interconnection; Low-k dielectric
Photonic crystal optical biosensor incorporating structured low-index porous dielectric
Keywords: کم دی الکتریک K; Optical biosensor; Low-k dielectric; Micro-replication; FDTD; Direct assay; Photonic crystal
S-parameters-based high speed signal characterization of Al interconnect on low-k hydrogen silsesquioxane-Si substrate
Keywords: کم دی الکتریک K; S-parameters; High speed interconnect; Hydrogen silsesquioxane; Coupling effect; Attenuation noise; Insertion loss; Low-k dielectric; Crosstalk;
Thermo-mechanical stresses in copper interconnects – A modeling analysis
Keywords: کم دی الکتریک K; Copper interconnect; Low-k dielectric; Computer simulation; Thermo-mechanical stress
Effect of internal stresses on thermo-mechanical stability of interconnect structures in microelectronic devices
Keywords: کم دی الکتریک K; Back-end structure; Cu interconnects; Low-K dielectric; Plasticity; Interfacial sliding; Thermo-mechanical cycling
Mechanical characterization of low-k and barrier dielectric thin films
Keywords: کم دی الکتریک K; Low-k dielectric; Mechanical properties; Elastic modulus; Poisson's ratio; Coefficient of thermal expansion;
Optimizing the precision of the four-point bend test for the measurement of thin film adhesion
Keywords: کم دی الکتریک K; Fracture and fracture toughness; Thin films; Interface adhesion; Low-k dielectric;