کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
661134 | 1458123 | 2010 | 9 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Visualization and thermal resistance measurement for the sintered mesh-wick evaporator in operating flat-plate heat pipes
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This work presents visualization and measurement of the evaporation resistance for operating flat-plate heat pipes with sintered multi-layer copper-mesh wick. A glass plate was adopted as the top wall for visualization. The multi-layer copper-mesh wick was sintered on the copper bottom plate. With different combinations of 100 and 200 mesh screens, the wick thickness ranged from 0.26Â mm to 0.8Â mm. Uniform heating was applied to the base plate near one end with a heated surface of 1.1Â ÃÂ 1.1Â cm2. At the other end was a cooling water jacket. At various water charges, the evaporation resistances were measured with evaporation behavior visualized for heat fluxes of 16-100Â W/cm2. Quiescent surface evaporation without nucleate boiling was observed for all test conditions. With heat flux increased, the water film receded and the evaporation resistance reduced. The minimum evaporation resistances were found when a thin water film was sustained in the bottom mesh layer. With heat flux further increased, partial dryout appeared with dry patches in the bottom mesh holes, first at the upstream end of the heated area and then expanded across the evaporator. The evaporation resistance re-rose in response to the appearance and expansion of partial dryout. When the fine 200 mesh screen was used as the bottom layer, its thinner thickness and stronger capillarity led to smaller minimum evaporation resistances.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 53, Issues 7â8, March 2010, Pages 1498-1506
Journal: International Journal of Heat and Mass Transfer - Volume 53, Issues 7â8, March 2010, Pages 1498-1506
نویسندگان
Jhan-Hong Liou, Chia-Wei Chang, Chi Chao, Shwin-Chung Wong,