Conjugate heat transfer in fractal-shaped microchannel network heat sink for integrated microelectronic cooling application

The hydrodynamic and thermal characteristics of fractal-shaped microchannel network heat sinks are investigated numerically by solving three-dimensional N–S equations and energy equation, taking into consideration the conjugate heat transfer in microchannel walls. It is found that due to the structural limitation of right-angled fractal-shaped microchannel network, hotspots may appear on the bottom wall of the heat sink where the microchannels are sparsely distributed. With slight modifications in the fractal-shaped structure of microchannels network, great improvements on hydrodynamic and thermal performance of heat sink can be achieved. A comparison of the performance of modified fractal-shaped microchannel network heat sink with parallel microchannels heat sink is also conducted numerically based on the same heat sink dimensions. It is found that the modified fractal-shaped microchannel network is much better in terms of thermal resistance and temperature uniformity under the conditions of the same pressure drop or pumping power. Therefore, the modified fractal-shaped microchannel network heat sink appears promising to be used for microelectronic cooling in the future.