کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
662482 1458143 2008 9 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Parametric study of multi-splat solidification/remelting including contact resistance effects
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
Parametric study of multi-splat solidification/remelting including contact resistance effects
چکیده انگلیسی

Solidification and remelting behavior of a series of deposited splats is investigated through numerical modeling. The non-perfect thermal contact at the interface between the splat and the substrate surface is accounted for by introducing a heat transfer coefficient. The effect of the interfacial thermal contact resistance as well as the effect of splat solidification parameters such as splat superheats, splat thickness, substrate temperature and splat deposition frequency on the resulting remelting depth of the previously solidified layer are discussed. Numerical results show that in the absence of thermal contact resistance between the splat and substrate interface, the remelting depth is underestimated. It is also found that the remelting depth increases for either an increase in substrate temperature or increasing splat thickness. In addition, the findings in the present study imply that in some practical applications, decreasing the deposit frequency would be a valid method to ensure the constant remelting thickness for depositing layers.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 51, Issues 19–20, September 2008, Pages 4811–4819
نویسندگان
, , ,