Dimensional optimization of microchannel heat sinks with multiple heat sources

Dimensional optimization of silicon microchannel heat sinks is performed by minimizing the total thermal resistance. Intel Core i7-900 Desktop Processor of chip core dimensions of 1.891 cm × 1.44 cm is considered as a reference processor which is reported to dissipate 130 W of heat. The properties are evaluated at the area weighted average of the fluid inlet and iteratively calculated outlet temperatures. The effects of the thermal and hydrodynamic entrance regions on heat transfer and flow are also investigated. The study is unique in that the optimization has been performed for localized multiple heat sources, as well as for a uniform heat load condition. The results of the optimization agreed very well with available ones in the literature.

► Analytical optimization of microchannel heat sink dimensions by thermal resistance minimization.
► Effects of hot spots in multiple local heat sources are included.
► Effects of the hydrodynamic and thermal entry regions, and property variations are considered.
► Intel Core i7-900 Desktop Processor is the reference processor.
► A wider range of pumping powers and temperatures are handled compared to the optimization studies available in the literature.