کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
681188 1460016 2013 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Removal of microelemental Cr(III) and Cu(II) by using soybean meal waste – Unusual isotherms and insights of binding mechanism
موضوعات مرتبط
مهندسی و علوم پایه مهندسی شیمی تکنولوژی و شیمی فرآیندی
پیش نمایش صفحه اول مقاله
Removal of microelemental Cr(III) and Cu(II) by using soybean meal waste – Unusual isotherms and insights of binding mechanism
چکیده انگلیسی

In the present study soybean meal (SBM) waste has been used for the removal Cr(III) and Cu(II) from aqueous solutions. Effect of variable parameters including pH, contact time, biomass dose and initial concentration of metal ions were studied. Biosorption kinetics was very fast and the kinetics data were successfully modeled using nonlinear pseudo-second-order model. A series of isotherm experiments revealed that pH 5 favored Cr(III) and Cu(II) biosorption and the affinity order of SBM was Cu(II) > Cr(III). Biosorption mechanism was confirmed by the functional group blocking, FTIR and scanning electron microscopy/energy-dispersive X-ray results. The biosorption mechanism was due to (i) ion-exchange, (ii) chelation by carboxyl and hydroxyl groups present on the SBM surface, (iii) further precipitation of metal ions on the surface of biomass. Our results revealed that SBM could be employed as an effective and low-cost biosorbent for removal of Cr(III) and Cu(II) from contaminated effluents.

Figure optionsDownload as PowerPoint slideHighlights
► Waste soybean meal biomass biosorbent was used for removal Cr(III) and Cu(II) ions.
► Effect of pH, contact time and initial concentrations on metal removal were investigated.
► Pseudo-second-order and Sips models best described the Cr(III) and Cu(II) biosorption.
► Unusual isotherms and biosorption mechanism was fully explored by characterization.
► The results recommend that soybean meal as potentially low-cost biosorbent.

ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Bioresource Technology - Volume 127, January 2013, Pages 350–357
نویسندگان
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