کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
6945436 1450513 2018 8 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Adhesion strength of die attach film for thin electronic package at elevated temperature
ترجمه فارسی عنوان
استحکام چسبندگی فیلم ضخیم برای بسته بندی نازک الکترونیکی در دمای بالا
موضوعات مرتبط
مهندسی و علوم پایه مهندسی کامپیوتر سخت افزارها و معماری
چکیده انگلیسی
Adhesion strength of a thin film for electronic packaging was investigated. The effects of temperature and loading rate on the adhesion were observed considering the viscoelasticity of adhesive. Various temperature conditions over the glass transition temperature of the adhesive were applied with controlled loading rates. A small hot plate was specially designed to control the temperature. Loading rate was controlled by a servo motor. A cantilever specimen was fabricated by two rectangular silicon chips. The adhesion was measured by a modified single cantilever beam method. Bending force was applied to the cantilever using rotatable jig. Adhesion strength was found to strongly depend on the temperature and loading rate. Below the glass transition temperature (Tg), the adhesion strength was increased with increasing loading rate. Near the Tg, the adhesion strength was decreased with increasing loading rate. Above the Tg, the adhesion strength did not significantly depend on the loading rate.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 91, Part 1, December 2018, Pages 15-22
نویسندگان
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