کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
6945466 | 1450515 | 2018 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی کامپیوتر
سخت افزارها و معماری
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates Shear strength and fracture surface analysis of Sn58Bi/Cu solder joints under a wide range of strain rates](/preview/png/6945466.png)
چکیده انگلیسی
The influences of the strain rate on the shear strength and failure mode of Sn58Bi/Cu solder joints were investigated. After reflowing, some Kirkendall voids were observed at the neighborhood of the Cu3Sn/Cu interface or in the inner Cu3Sn layer. In addition, another type of void could also be observed inside the Sn58Bi eutectic solders, and its size was much larger than that of Kirkendall voids. Some Bi particles were obviously found to segregate at the interface between the Cu-Sn IMC and the Sn58Bi solder. The single lap shear test results indicated that the strain rate had an important influence on the shear strength and failure mode of Sn58Bi/Cu solder joints. The shear strength of joints demonstrated increment at first and then decrement as the strain rate increased from 3.33â¯Ãâ¯10â4â¯sâ1 to 3.33â¯sâ1. It was observed that all Sn58Bi/Cu solder joints broke in a mixed-type fracture mode under a wide range of strain rates. Additionally, more broken IMC grains were exposed on the fracture face and more fracture occurred within the IMC layer with increasing strain rate. Furthermore, the fracture path gradually moved from the solder side to the inner IMC side as the strain rate increased.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Microelectronics Reliability - Volume 86, July 2018, Pages 27-37
Journal: Microelectronics Reliability - Volume 86, July 2018, Pages 27-37
نویسندگان
Yongqiang Wan, Shuang Li, Xiaowu Hu, Yu Qiu, Tao Xu, Yulong Li, Xiongxin Jiang,