The stress reduction effect by interlayer deposition or film thickness for diamond like carbon on rough surface

The effects of thermal stress resulting from thermal cooling for diamond like carbon (DLC) films on a rough surface are investigated by a finite element analysis. Two different schemes, interlayer deposition (metallic interlayer, multi-interlayer, grade interlayer) and film thickness increase are proposed to relieve the stress. The results show that the film thickness and coefficient of thermal expansion (CTE) are critical in stress reduction for a single interlayer. The metallic interlayer is effective in stress reduction only if the CTE of the interlayer is between that of the substrate and the film. Grade interlayer can further reduce the stress if the plasticity is graded in the interlayer. The increase of film thickness can also reduce the thermal stress, even though it is not as effective as the interlayer approach.