Thermal characterization of full-scale PCM products and numerical simulations, including hysteresis, to evaluate energy impacts in an envelope application

The simulations were done using a previously-validated two-dimensional (2D) wall model containing a PCM layer and incorporating the HFMA-measured enthalpy functions. The wall model was modified to include the hysteresis phenomenon observed in PCMs, which is reflected in different melting and freezing temperatures of the PCM. Simulations were done with a single enthalpy curve based on the PCM melting tests, both melting and freezing enthalpy curves, and with different degrees of hysteresis between the melting and freezing curves. Significant differences were observed between the thermal performances of the modeled wall with the PCM layer under the different scenarios.