کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7051979 | 1457396 | 2017 | 41 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A correlation of nanofluid flow boiling heat transfer based on the experimental results of AlN/H2O and Al2O3/H2O nanofluid
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
Nanofluid flow boiling is becoming a research focus these years, although few correlation of nanofluid flow boiling was proposed in the last researches. In this paper, nanofluid was prepared by adjusting the nanoparticles into the deionized water and dispersing by an ultrasonic oscillation. Nanofluid saturated flow boiling heat transfer in a vertical tube is experimentally investigated in this work. Furthermore, nanoparticle shapes and sizes are scanned by TEM before and after boiling and it has been ensured that the nanoparticles haven't been changed during the experimental process. Several relevant dimensionless parameters for nanofluid saturated flow boiling were proposed to present the influences of heat flux, pressure and thermal properties. Based on the research above, a new correlation for nanofluid saturated flow boiling was presented with 300 experimental points. This correlation apply to both AlN/H2O nanofluid and Al2O3/H2O nanofluid (0.1-0.5 Vol.%). The pressure range of application for the correlation is 0.2-0.8 MPa, and it is 48-289 kW mâ2 for heat flux, 350-1100 kg mâ2 sâ1 for mass flow rate. The correlation adjust residual sum of squares (A-R2) is 0.9594. Its mean absolute deviation (MAD) is 4.3% and it predicts 99% of the entire database within ±15% for AlN/H2O nanofluid and 94.5% of the entire database within ±15% for Al2O3/H2O nanofluid.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Experimental Thermal and Fluid Science - Volume 80, January 2017, Pages 376-383
Journal: Experimental Thermal and Fluid Science - Volume 80, January 2017, Pages 376-383
نویسندگان
Y. Wang, K.H. Deng, B. Liu, J.M. Wu, G.H. Su,