Innovative analytic and experimental methods for thermal management of SMD-type LED chips

In this study, we propose innovative analytic and experimental methods for thermal management of SMD-type LED chips: a geometry optimization algorithm of natural convective heat sinks together with a novel technique for estimation of the LED surface temperature. An analytic algorithm for the optimal design of the LED heat sink is proposed. By using this algorithm, the optimal fin configuration and corresponding thermal performance of the heat sink can be readily predicted according to the inputted base plate dimensions, ambient condition, heat dissipation rate, and LED chip distributions. In addition, a novel experimental technique for an accurate measurement of the LED junction temperature is proposed based on infrared thermometry and an isothermal chamber with an observation hole. The LED junction temperature is also measured using T3ster method, and the results are compared with those from the aforementioned infrared thermometry and analytic procedure. The proposed analytic and experimental results are shown to agree with each other well. The present analytic model is well validated by experimental results, and can be widely utilized for designing the cooling system related to various LED products.