کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7054187 | 1458016 | 2018 | 12 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of nano-structure coating on thermal performance of thermosyphon boiling in micro-channels
ترجمه فارسی عنوان
اثر پوشش نانو ساختار بر عملکرد حرارتی گرماسویفون جوش در میکرو کانال
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
چکیده انگلیسی
A novel micro-channel thermosyphon technology for passively cooling 3D stacked chips was provided, and the thermosyphon boiling characteristics in vertical and inclined micro-channels with two open ends which simulate the specific stacked structure of actual 3D chip were experimentally carried out. In order to improve the heat transfer of micro-channel thermosyphon by surface treatment technology, four kinds of nanoparticles (CuO, Cu, Al2O3, SiO) were added to the base fluid to make nano-structure coatings on the heater surfaces by using a long time pool boiling treatment. Then, micro-channel thermosyphon boiling experiments were carried out with four kinds of working liquids: two kinds of pure fluids (deionized water and R113) and two kinds of moist fluids (deionized water+surfactant and R113+surfactant). The gaps and heights of micro-channels tested were in the range of 30-60â¯Î¼m and 30-90â¯mm, respectively. Experimental results show that nano-structure coatings can significantly enhance both the maximum heat flux and heat transfer coefficient of thermosyphon boiling in micro-channels, and exist both the optimal nanoparticle kind and nanoparticle concentration in the base fluids. The experimental results provided some meaningful technology support for 3D stacked chip cooling.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 124, September 2018, Pages 463-474
Journal: International Journal of Heat and Mass Transfer - Volume 124, September 2018, Pages 463-474
نویسندگان
Shuang-Fei Li, Yi-Ying Bao, Ping-yang Wang, Zhen-hua Liu,