کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7057294 | 1458070 | 2014 | 11 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
CFD modeling of pin shape effects on capillary flow during wave soldering
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی شیمی
جریان سیال و فرایندهای انتقال
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
This paper presents an effective numerical method for evaluating the effect of the pin-through-hole (PTH) shape on the soldering stage using wave soldering technique. Three-dimensional finite volume numerical approach was employed to investigate capillary flow behavior when the PTH component with different pin shapes passes through molten solder (63Sn37Pb). An experiment was carried out on a single circular pin and compared with FLUENT simulation. Various PTH shapes, such as circle, triangle, square, rectangle, and hexagon, were modeled and meshed using computational fluid dynamics pre-processing software GAMBIT. The solder melt front was tracked using the volume of the fluid model. Using the circular PTH pin yielded the fastest front advancement during soldering, whereas the angle-edged PTH component increased the filling time and resulted in an uneven profile. Solder profile prediction was substantiated by experimental results. The current simulation results are expected to provide a better understanding of capillary action in various PTH geometrical shapes during wave soldering.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: International Journal of Heat and Mass Transfer - Volume 72, May 2014, Pages 400-410
Journal: International Journal of Heat and Mass Transfer - Volume 72, May 2014, Pages 400-410
نویسندگان
M.S. Abdul Aziz, M.Z. Abdullah, C.Y. Khor, A. Jalar, F. Che Ani,