A phenomenological study of a Sn-Ag-Al composite solder reinforced with Mg-MWCNT: Improved electrical conductivity and thermo-physical performance

A Sn-Ag-Al composite solder alloy reinforced with Mg-MWCNT was found to exhibit higher electrical conductivity, lower density and melting temperature, and better wetting behavior than a Sn-Ag-Al conventional solder alloy. Thus, the Sn-Ag-Al-Mg-MWCNT composite solder bumps were more suitable for interconnection applications than the Sn-Ag-Al conventional solder bumps.183