Full split C–V method for parameter extraction in ultra thin BOX FDSOI MOS devices

• We emphasize usefulness of gate-to-bulk capacitance (Cgb) in UTBB FDSOI.
• Cgb configuration in FDSOI devices can provide detail substrate information.
• TCAD and an improved coupling model confirmed our parameter extraction.
• This method can be useful to assess full gate-stack without destructive analysis.

The feasibility of full split C–V method in ultra-thin body and BOX (UTBB) FDSOI devices is demonstrated, emphasizing the usefulness of gate-to-bulk capacitance. The split C–V measurements carried out on both gate-to-channel and gate-to-bulk mode are shown to be consistent with TCAD simulation. This enabled us to propose an improved parameter extraction methodology for the whole vertical FDSOI stack from gate to substrate using back biasing effect.