کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
747690 1462214 2016 5 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
A study on geometry effect of transmission coil for micro size magnetic induction coil
ترجمه فارسی عنوان
مطالعه ای در مورد اثر هندسه کویل انتقال برای سیم پیچ القایی مغناطیسی کوچک
کلمات کلیدی
انتقال قدرت بی سیم، میکرو سیم پیچ دستگاه ایمپلنت
موضوعات مرتبط
مهندسی و علوم پایه سایر رشته های مهندسی مهندسی برق و الکترونیک
چکیده انگلیسی


• Foundational wireless power transferring system for micro-size magnetic induction coil is studied.
• For high efficient power transmission with micro-size Rx coil, Tx coil should be smaller than working distance.
• Double coil system is proposed for high efficient wireless remote power transmission targeting body implantable devices.

The effects of transmission (Tx) coil structure have been studied for micro-size magnetic induction coil. The size of the receiving (Rx) coil should be shrunk to the micrometer level for the various new applications such as micro-robot and wireless body implanted devices. In case of the macro-scale magnetic induction coil, the power transmission efficiency is generally considered to be higher as the inductance of the transmission coil became larger; however, the large size difference between macro-size Tx coil and micro-size Rx coil can decrease the power transmission efficiency due to the difference of resonance frequency. Here, we study a correlation of the power transmission with the size and distance between the macro-size Tx and micro-size Rx coils using magnetic induction technique. The maximum power efficiency was 0.28/0.23/0.13/0.12% at the distance of 0.3/1/3/5 cm between Rx and Tx coil. In addition, more efficient wireless power transferring method is suggested with a floating coil for the body implantable devices. The voltage output increased up to 5.4 mV than the original one Tx coil system. The results demonstrated the foundational wireless power transferring system with enhanced power efficiency.

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ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Solid-State Electronics - Volume 119, May 2016, Pages 45–49
نویسندگان
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