کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7887070 1509788 2018 10 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Wetting and low temperature bonding of zirconia metallized with Sn0.3Ag0.7Cu-Ti alloys
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
Wetting and low temperature bonding of zirconia metallized with Sn0.3Ag0.7Cu-Ti alloys
چکیده انگلیسی
The wettability of zirconia with Sn0.3Ag0.7Cu-Ti (SAC-Ti) alloys was investigated via the sessile drop method with the increase of temperature. Zirconia, pre-metallized with SAC-Ti metal powder at 900 °C, was brazed to copper using an SAC solder paste at the low temperature of 250 °C. The active element Ti reduced the contact angle as the temperature increased. The lowest contact angle of 8° was obtained with SAC-4 wt% Ti which possessed sufficient Ti and appropriate fluidity. When zirconia was pre-metallized with SAC-4 wt% Ti alloy, the typical microstructure of the copper/SAC/zirconia joint was copper/Cu6Sn5 layer/β-Sn layer containing Ti3Sn and Ti6Sn5 phases/Ti3Sn layer/TiOx layer/zirconia. As the Ti content increased, more Ti-Sn intermetallic compounds remained in the seam, and the shear strength increased first and thereafter decreased. The highest shear strength of 19.1 MPa was achieved as zirconia was pre-metallized with SAC-4 wt% Ti. Fracture analyses indicated that brittle fracture was initiated at the reaction layers adjacent to zirconia and propagated in the seam during shear test.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ceramics International - Volume 44, Issue 10, July 2018, Pages 11456-11465
نویسندگان
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