کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7887070 | 1509788 | 2018 | 10 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Wetting and low temperature bonding of zirconia metallized with Sn0.3Ag0.7Cu-Ti alloys
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
سرامیک و کامپوزیت
پیش نمایش صفحه اول مقاله
چکیده انگلیسی
The wettability of zirconia with Sn0.3Ag0.7Cu-Ti (SAC-Ti) alloys was investigated via the sessile drop method with the increase of temperature. Zirconia, pre-metallized with SAC-Ti metal powder at 900â¯Â°C, was brazed to copper using an SAC solder paste at the low temperature of 250â¯Â°C. The active element Ti reduced the contact angle as the temperature increased. The lowest contact angle of 8° was obtained with SAC-4â¯wt% Ti which possessed sufficient Ti and appropriate fluidity. When zirconia was pre-metallized with SAC-4â¯wt% Ti alloy, the typical microstructure of the copper/SAC/zirconia joint was copper/Cu6Sn5 layer/β-Sn layer containing Ti3Sn and Ti6Sn5 phases/Ti3Sn layer/TiOx layer/zirconia. As the Ti content increased, more Ti-Sn intermetallic compounds remained in the seam, and the shear strength increased first and thereafter decreased. The highest shear strength of 19.1â¯MPa was achieved as zirconia was pre-metallized with SAC-4â¯wt% Ti. Fracture analyses indicated that brittle fracture was initiated at the reaction layers adjacent to zirconia and propagated in the seam during shear test.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Ceramics International - Volume 44, Issue 10, July 2018, Pages 11456-11465
Journal: Ceramics International - Volume 44, Issue 10, July 2018, Pages 11456-11465
نویسندگان
H. Bian, W. Fu, Y.Z. Lei, X.G. Song, D. Liu, J. Cao, J.C. Feng,