The effect of a buffer layer on the structure and the performance of cutting-tools for ZrWN films that are deposited using DCMS and HIPIMS

This paper determines the optimal settings for the deposition of ZrWN nitride films using reactive direct current magnetron sputtering (DCMS) and high-power impulse magnetron sputtering (HIPIMS), with pure Zr and W metal targets and Ar plasma and N2 reactive gases. The materials tested as buffer layers are metal tungsten (W) and tungsten nitride (WN) thin films. Using a Taguchi method, this study determines the effect of deposition parameters for the buffer layer (W DC power, substrate bias, N2/(N2+Ar) flow rate and substrate temperature) on the structural and mechanical properties, and the dry machining performance of cutting-tools for multilayer ZrWN/W and ZrWN/WN/substrates. In the confirmation runs using grey Taguchi analysis, there is an improvement of 32.31% and 13.38% in surface roughness and flank wear, respectively. The films are characterized using X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (FEI-TEM) and a nanoindenter. The TEM pattern for the ZrWN films shown corresponds to the (111), (200) and (220) planes of the face-center-cubic phase. Pretreatment of a tungsten carbide tool uses oxygen plasma etching to enhance the adhesion of the multilayer ZrWN/WN coating. Compared with coatings that are deposited using DCMS, the samples that are deposited using HIPIMS exhibit a higher film density and a smoother surface. In the HIPIMS mode, the XRD diffraction peaks of the films are sharper and more intense, which indicates an improvement in crystallinity.