Joining of dense Si3N4 ceramics with tape cast Lu-Al-Si-O-N interlayer

Lu-Al-Si-O-N tapes with different thickness were used to join gas pressure sintered Si3N4 ceramics. The microstructure of the joints and the influences of the joint thickness and joining temperature on the bonding strength of the as-joined Si3N4 ceramics have been investigated. The highest bonding strength about ~ 300 MPa of the joined specimens was achieved by using 450 µm interlayer at 1450 °C. The existence of Si3N4 nanowires was beneficial for the improvement of the bonding strength by interweaving the oxynitride glass matrix in the joint region.