The evolution and analysis of electrical percolation threshold in nanometer scale thin films deposited by electroless plating

► The evolution of percolation threshold in electroless deposited Ag and Cu thin films was studied and ELD as a method for controllable percolation was analyzed. ► It was observed that Ag and Cu thin films reach percolation threshold at the thicknesses of 35 nm and 30 nm, respectively. ► It has been shown that the film resistivity varies according to power law. The critical exponents of 0.95 and 1.04 for Ag and Cu, respectively, were extracted.