کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7979178 | 1514718 | 2015 | 18 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
A new dynamic recrystallisation model of an extruded Al-Cu-Li alloy during high-temperature deformation
ترجمه فارسی عنوان
یک مدل جدید بازسازی پویا از یک آلیاژ آلومینیومی اکسترود شده در طول تغییر شکل با درجه حرارت بالا
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کلمات کلیدی
انتقالی دینامیکی، آلومینیوم آلومینیوم، تکامل میکروارگانیسم، مرز دانه، پراش پرتو الکترونی،
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
دانش مواد (عمومی)
چکیده انگلیسی
The high-temperature deformation behaviour and microstructure evolution of an extruded Al-Cu-Li alloy were investigated by compression tests conducted at various temperatures (613, 673 and 733Â K) with various strain rates (0.001, 0.01, and 0.1Â s-1). The results indicated that the deformation activation energy increased from 208.7Â kJ/mol to 255.7Â kJ/mol with an increase in strain from 0.1 to 0.7. The electron backscatter diffraction maps indicated that a dynamic recrystallisation occurred during the high-temperature deformation. Two types of recrystallisation mechanisms, grain boundary bulging and a grain boundary transformation from low misorientation to high misorientation, were considered as the mechanisms for controlling the formation of the recrystallised grains. A new dynamic recrystallisation model containing these two mechanisms was proposed to describe the microstructure evolution of the extruded Al-Cu-Li alloy. At the early stage of the deformation, the recrystallised grains were formed by grain boundary bulging along the original grain boundaries. With increasing strain, recrystallised grains were gradually generated in the deformed grains due to the transformation from low angle boundaries to high angle boundaries.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Science and Engineering: A - Volume 625, 11 February 2015, Pages 288-295
Journal: Materials Science and Engineering: A - Volume 625, 11 February 2015, Pages 288-295
نویسندگان
Bo Shen, Lei Deng, Xinyun Wang,