کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
7990472 1516129 2018 36 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research
چکیده انگلیسی
In this study, Sn9Zn-1Al2O3-xCu (x = 0, 1.5, 4.5, 6 wt %) composite solder is used to investigate the effect of Cu element and Al2O3 particles addition in soldering 6061 aluminum alloys. First-principle calculations were performed to explore the interface structure, interfacial energy, contact angle, and electronic properties of the Al2O3/Sn9Zn interface. Wettability, microstructure, interface morphology, hardness and mechanical properties of Sn9Zn-1Al2O3-xCu soldering 6061 aluminum alloys were examined in experimental section. In the calculation part, Sn9Zn-1Al2O3-4.5Cu and Sn9Zn-1Al2O3-6Cu show stable structures. For experiments, when the content of Cu element is 4.5%, a large amount of fine Cu5Zn8 phases appear in the soldering seam, and the Al4Cu3Zn solid solution layer is the thinnest and flattest. Meanwhile, using Sn9Zn-1Al2O3-4.5Cu solder, the wetting area and shear strength are increased by 27.12% and 75.6% respectively compared with the original Sn9Zn-1Al2O3 solder, which was attributed to a second phase of Cu5Zn8 strengthening mechanism. The Cu5Zn8 phases can generate obstacle for the dislocation at the grain boundary.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 765, 15 October 2018, Pages 128-139
نویسندگان
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