کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7990472 | 1516129 | 2018 | 36 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Effect of Cu element addition on the interfacial behavior and mechanical properties of Sn9Zn-1Al2O3 soldering 6061 aluminum alloys: First-principle calculations and experimental research
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله

چکیده انگلیسی
In this study, Sn9Zn-1Al2O3-xCu (xâ¯=â¯0, 1.5, 4.5, 6â¯wt %) composite solder is used to investigate the effect of Cu element and Al2O3 particles addition in soldering 6061 aluminum alloys. First-principle calculations were performed to explore the interface structure, interfacial energy, contact angle, and electronic properties of the Al2O3/Sn9Zn interface. Wettability, microstructure, interface morphology, hardness and mechanical properties of Sn9Zn-1Al2O3-xCu soldering 6061 aluminum alloys were examined in experimental section. In the calculation part, Sn9Zn-1Al2O3-4.5Cu and Sn9Zn-1Al2O3-6Cu show stable structures. For experiments, when the content of Cu element is 4.5%, a large amount of fine Cu5Zn8 phases appear in the soldering seam, and the Al4Cu3Zn solid solution layer is the thinnest and flattest. Meanwhile, using Sn9Zn-1Al2O3-4.5Cu solder, the wetting area and shear strength are increased by 27.12% and 75.6% respectively compared with the original Sn9Zn-1Al2O3 solder, which was attributed to a second phase of Cu5Zn8 strengthening mechanism. The Cu5Zn8 phases can generate obstacle for the dislocation at the grain boundary.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 765, 15 October 2018, Pages 128-139
Journal: Journal of Alloys and Compounds - Volume 765, 15 October 2018, Pages 128-139
نویسندگان
Yu Lu, Le Ma, Shu-yong Li, Wei Zuo, Zhi-qiang Ji, Min Ding,