Microstructure and properties of in-situ TiC reinforced copper nanocomposites fabricated via long-term ball milling and hot pressing

Cu-matrix nanocomposites reinforced with in-situ TiC were fabricated using long-term ball milling and hot pressing. Their hardness and electrical conductivity simultaneously increased with the enlargement of ball milling time after 84 h. The novel findings provide a potentially competitive strategy for developing the high-performance Cu-based composite materials. The improved electrical properties were due to the fraction increase of micro-sized pure Cu areas. The enhanced hardness resulted from the formation of composite areas that contained the nano-sized Cu and TiC. Such microstructure depended on the refinement and more homogeneous mixing of Cu and Ti nanopowders caused by enlarging ball milling time.