کد مقاله | کد نشریه | سال انتشار | مقاله انگلیسی | نسخه تمام متن |
---|---|---|---|---|
7995217 | 1516163 | 2018 | 22 صفحه PDF | دانلود رایگان |
عنوان انگلیسی مقاله ISI
Quantitative analysis of bending fracture resistance of nanoscale Cu-buffered ZnO:Al thin films on a polymer substrate
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کلمات کلیدی
موضوعات مرتبط
مهندسی و علوم پایه
مهندسی مواد
فلزات و آلیاژها
پیش نمایش صفحه اول مقاله
![عکس صفحه اول مقاله: Quantitative analysis of bending fracture resistance of nanoscale Cu-buffered ZnO:Al thin films on a polymer substrate Quantitative analysis of bending fracture resistance of nanoscale Cu-buffered ZnO:Al thin films on a polymer substrate](/preview/png/7995217.png)
چکیده انگلیسی
Improving the fracture resistance of fragile inorganic thin films under various bending conditions is critical in flexible thin-film systems. Here, we introduce a Cu-buffer-layer approach to evaluate the level of enhancement in the bending fracture behavior of Al-doped ZnO (AZO) thin films on the basis of quantitative mechanical parameters such as fracture energy, film strength and fracture toughness. These fracture behaviors of thin films sputter-deposited onto polyethersulfone substrates were observed to depend largely on the thickness of the Cu buffer layer. In the case of thin films with a 20Â nm-thick Cu buffer layer, crack-initiating bending strain was substantially improved from â¼1.04% to â¼1.37%; this corresponds to an improvement of â¼31.7%. The substantial improvement is attributed to the presence of the Cu buffer layer, which helps prevent the formation of cracks by absorbing crack-initiating tensile stress. The calculated values of fracture energy and film strength support well the Cu thickness dependence of fracture behavior under bending operation.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Journal of Alloys and Compounds - Volume 731, 15 January 2018, Pages 49-54
Journal: Journal of Alloys and Compounds - Volume 731, 15 January 2018, Pages 49-54
نویسندگان
Seung Won Kim, Hong Je Choi, Yong Soo Cho,