Thermodynamic description of the binary Au-Sb and ternary Au-In-Sb systems

Indium and antimony are two of the most important components in the lead-free soldering process. Furthermore, an electroless Au/Ni metallization layer is a very common resistant layer between the solder and the copper substrate. The knowledge of the phase relationship between solder and substrate is essential for the electronic industry. In this paper, a new thermodynamic modeling of the binary Au-Sb and ternary Au-In-Sb systems is proposed. A good agreement was found between the modeled phase diagrams and the experimental data.