Effects of Ti addition to Sn-Ag and Sn-Cu solders

► Ti additions to Sn-Cu and Sn-Ag solders can effectively reduce the undercooling. ► Increasing the cooling rate will increase the hardness of Ti-added solders. ► Ti2Sn3 networks stabilize the morphology of β-Sn even in a severe aging condition. ► The orientation distribution of β-Sn can be preserved after a minor addition of Ti. ► Ti-added solder may be a superior candidate for enhanced electromigration resistance.