کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8021685 1517279 2013 4 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Influence of texture of Cu on the growth of Cu-Sn intermetallic compounds
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Influence of texture of Cu on the growth of Cu-Sn intermetallic compounds
چکیده انگلیسی
Influence of Cu texture orientation on the growths of IMCs in the joints with small volume of solder (10 μm electroplated Sn layer) was investigated. IMCs (Cu6Sn5 and Cu3Sn) formed on the Cu with different texture orientation displayed different morphologies. The average grain size of IMCs on the electroplated Cu with text orientation (220) is larger than that of Cu substrate with the text orientation (200), and the thickness of the IMCs at the electroplated Cu (220) is larger than those formed at the Cu substrate (200). After aging at 150 °C for 96 h, the IMCs almost penetrated the entire Sn layer at some points.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Materials Letters - Volume 109, 15 October 2013, Pages 8-11
نویسندگان
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