Ni-P electroless deposition directly induced by sodium borohydride at interconnected pores of poly (ether ether ketone)/multiwalled carbon nanotubes composites surface

In this study, an interpenetrated anchorage connection between Ni-P coating and poly (ether ether ketone)/multiwalled carbon nanotubes (PEEK/MWCNT) composites was realized by electroless deposition process. The absorbed NaBH4 reduced the Ni2 + ions in electroless plating bath to Ni0 species and simultaneously the Ni0 acted as catalyst initiating the electroless deposition. SEM, EDS, XPS, and XRD were used to characterize each step of the process. The thickness and weight of the coating both increased over time linearly. The coating rate was 4.68 μm h− 1 and there was no induction period in the electroless process. After electroless deposition for 20 min, the sheet resistance of the samples dropped to 0.78 Ω/square. And the volume resistivity in the direction of thickness dropped sharply from 1.0 × 105 Ω m to 1.0 Ω m after N-P deposition for 10 min. An interpenetrating anchorage effect was formed between the Ni-P coating and the PEEK/MWCNT composite surface, which contributed to a good adhesion (the highest 5 B scale according to ASTM D3359 and 5.7 MPa by pull off test).