کد مقاله کد نشریه سال انتشار مقاله انگلیسی نسخه تمام متن
8029581 1517646 2013 36 صفحه PDF دانلود رایگان
عنوان انگلیسی مقاله ISI
Simulation-based optimization of laser shock peening process for improved bending fatigue life of Ti-6Al-2Sn-4Zr-2Mo alloy
موضوعات مرتبط
مهندسی و علوم پایه مهندسی مواد فناوری نانو (نانو تکنولوژی)
پیش نمایش صفحه اول مقاله
Simulation-based optimization of laser shock peening process for improved bending fatigue life of Ti-6Al-2Sn-4Zr-2Mo alloy
چکیده انگلیسی
Laser shock peening (LSP) induced residual stresses significantly affect the high cycle fatigue behavior of certain metals and alloys. Residual stress distribution is a function of various laser parameters (energy, laser pulse width, and spot diameter), the geometry, the material and the laser shot sequencing. Considering the wide range of parameters involved in the LSP process, a numerical approach based on 3D nonlinear finite element method has been employed to explore the relation between the processing parameters and the residual stress distribution. This methodology is applied to a thin coupon of Ti-6Al-2Sn-4Zr-2Mo (Ti-6242) alloy, with a view towards establishing conditions for obtaining through-thickness compressive residual stresses and hence improved bending fatigue life. Material response at very high strain rates in the LSP process is effectively represented using the modified Zerilli-Armstrong material model. The numerical approach is verified by comparison with the experimental results. Effects of laser parameters and laser shot sequencing on final residual stress distribution are studied by performing full scale simulations of LSP patches constituting a large number of laser shots. Based on simulation studies, optimal set of parameters is obtained that produces through thickness compression, which leads to a substantial improvement in bending fatigue life. Fatigue testing results support the recommendations made based on simulation results.
ناشر
Database: Elsevier - ScienceDirect (ساینس دایرکت)
Journal: Surface and Coatings Technology - Volume 232, 15 October 2013, Pages 464-474
نویسندگان
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